Beitrag in einem Tagungsband
High Voltage Robustness of Mold Compounds under Different Environmental Conditions



Details zur Publikation
Autor(inn)en:
Paye, J.; Claudi, A.; Stecher, M.
Herausgeber:
IEEE
Publikationsjahr:
2015
Seitenbereich:
CP.5.1 - CP.5.6
Buchtitel:
Reliability Physics Symposium (IRPS), 2015 IEEE International
Jahrgang/Band:
2015

Zusammenfassung, Abstract
To ensure a high degree of safety in electrical systems, it is essential to understand the dielectric breakdown mechanism of packaging materials under different environmental conditions. In this article, the insulation failure of various mold compounds was examined throughout electrical breakdown tests and partial discharge measurement. The obtained results suggest a high involvement of space charges in the dielectric breakdown and point out an increase of the dielectric strength with increased humidity content.


Autor(inn)en / Herausgeber(innen)

Zuletzt aktualisiert 2019-25-07 um 11:02