Aufsatz in einer Fachzeitschrift
On the Electric Breakdown Behavior of Silicone Gel at Interfaces
Details zur Publikation
Autor(inn)en: | Finis, G.; Claudi, A. |
Publikationsjahr: | 2008 |
Zeitschrift: | IEEE Transactions on Dielectrics and Electrical Insulation |
Seitenbereich: | 366-373 |
Jahrgang/Band : | 15 |
Erste Seite: | 366 |
Letzte Seite: | 373 |
ISSN: | 1070-9878 |
eISSN: | 1558-4135 |
DOI-Link der Erstveröffentlichung: |
Zusammenfassung, Abstract
Electrically stressed interfaces between solids are considered as weak points in the electrical insulation technology. This matter of fact is founded in the presence of microscopic cavities or areas with a low material density in the interface layer. Silicone gel, which is a soft and conformable solid with certain tackiness, offers a good adaptation to any surface and the ability to fill in voids completely. Due to these properties the silicone gel is predestinated for the use at electrically stressed interfaces. The work presented, describes the electric breakdown behavior of the material used at interfaces. The results provide practical information for the design of electrical insulation using silicone gel.
Electrically stressed interfaces between solids are considered as weak points in the electrical insulation technology. This matter of fact is founded in the presence of microscopic cavities or areas with a low material density in the interface layer. Silicone gel, which is a soft and conformable solid with certain tackiness, offers a good adaptation to any surface and the ability to fill in voids completely. Due to these properties the silicone gel is predestinated for the use at electrically stressed interfaces. The work presented, describes the electric breakdown behavior of the material used at interfaces. The results provide practical information for the design of electrical insulation using silicone gel.
