Aufsatz in einer Fachzeitschrift

Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains



Details zur Publikation
Autor(inn)en:
Hou, X.; Krauß, S.; Merle, B.
Verlag:
PERGAMON-ELSEVIER SCIENCE LTD

Publikationsjahr:
2019
Zeitschrift:
Scripta Materialia
Seitenbereich:
55-59
Jahrgang/Band :
165
Erste Seite:
55
Letzte Seite:
59
Seitenumfang:
5
ISSN:
1359-6462
DOI-Link der Erstveröffentlichung:


Zusammenfassung, Abstract
The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.


Schlagwörter
Bimodal grained microstructure, Crystal structure, Grain boundary strengthening, Hall-Petch effect, Mechanical property testing


Autor(inn)en / Herausgeber(innen)

Zuletzt aktualisiert 2023-18-07 um 09:08