Journal article
Thermomechanical stress analysis and measurement in quasi-monolithic integration technology (QMIT)
Publication Details
Authors: | Joodaki, M.; Kompa, G.; Hillmer, H. |
Publication year: | 2005 |
Journal: | IEEE Transactions on Device and Materials Reliability |
Pages range : | 581-594 |
Volume number: | 5 |
Issue number: | 3 |
ISSN: | 1530-4388 |
eISSN: | 1558-2574 |
